【Academic Talks】Integration of low dimensional materials for sensing applications

Published:2021-11-10Author:刘振Number of Visits:45

Titles

 Integration of low dimensional materials for sensing applications


TimeNov 19, 2021, 5pm (Beijing Time)

Locationonline

https://teams.microsoft.com/l/meetup-join/19%3ameeting_Zjc3OGY5YzAtZTc3Yy00OTYyLTkxY2QtNDc0MTdiNGQ2YTA4%40thread.v2/0?context=%7b%22Tid%22%3a%22eeca2b51-a5d9-418a-a603-9ae0203f43a4%22%2c%22Oid%22%3a%224383d80d-1347-4c76-8767-a81d04a59cfc%22%7d


SpeakersRebecca Cheung

Professor Rebecca Cheung received her secondary and tertiary education in Scotland. After obtaining a first class honours degree in Electronics and Electrical Engineering from the University of Glasgow, she was awarded a Scholarship from the Croucher Foundation to study towards a Ph.D, which she received from the same University in 1990. During her Ph.D, she was a visiting researcher with the Semiconductor Technology Group at IBM Thomas J. Watson Research Centre in Yorktown Heights, USA, where high density plasma etching techniques were developed for GaAs nanostructures. The process-induced material damage was characterised using x-ray photoelectron spectroscopy and quantum transport techniques.

 

Professor Cheung joined the University of Edinburgh in 2000 and her current research interests include Silicon Carbide Microelectromechanical Systems, Biomimetical Systems and Graphene. She is funded by EPSRC and Scottish Enterprise to develop fabrication processes and technologies for the production of microelectromechanical systems in silicon carbide; as well as a multi-channel biomimetical system consisting of an array of resonating gate transistors integrated with neural electronics for mimicking the cochlea.

 

Previously, Professor Cheung had been a visiting scientist with the Mesoscopic Physics Group in the Department of Applied Physics at Delft Institute of Microelectronics and Submicron Technology, The Netherlands; the Semiconductor Technology Group at the Laboratory for Electromagnetic Fields and Microwave Electronics, ETHZ, Switzerland and the Nanoelectronics Research Center at Glasgow, working on various topics related to semiconductor technology, process-induced materials damage in GaAs nanostructures, mesoscopic physics in SiGe heterostructures and microwave circuits in InP for gigabit electronics.

 

Additionally, she had been a founding member of the Nanostructure Engineering Science and Technology (NEST) Group at the University of Canterbury in New Zealand in 1998, with research funding from the prestigious Marsden Fund administered by the Royal Society of New Zealand for the research programme Science and Engineering of Nanostructures and Devices.

 

Professor Cheung serves on numerous conference committees and scientific panels. She had been elected a Fellow of the Royal Society of Edinburgh in 2012, is a senior member of the IEEE, a Fellow of the IET and is an Honorary Professor with the School of Engineering and Physical Sciences at Heriot-Watt University.

 

In 2013, Professor Cheung served as Program Chair for the 57th International Conference on Electron, Ion, Photon Beam Technology and Nanofabrication (EIPBN), the premier conference on the science and technology of nanopatterning; and now serves in the conference advisory committee.

 

 

College of Chemical Engineering

2021.11.10